shinko substrate

The patent's assignee for patent number 9736941 is SHINKO ELECTRIC INDUSTRIES CO., LTD. (Nagano, JP). News editors obtained the following quote from the background information supplied by the inventors: "A wiring substrate in which a low-density

相關軟體 Safeplicity 下載

Safeplicity is a really useful tool that is deal for anyone who has sensitive files, which they would like to password-protect but don't know how. With Safeplicity, you can password-protect and encr...

了解更多 »

  • Related to the recent performance improvement of electronic devices using Build-up Substra...
    Build-up Substrate(Flip-chip type) | IC Package | SHINKO ELE ...
    http://www.shinko.co.jp
  • The Plastic-BGA substrates are mainly used for memory, controller, chipsets, and on-vehicl...
    P-BGA Substrate | Products & Services | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • The Requirement of Future Substrate-Maker Point of View - Dyi-Chung Hu ((((胡迪群))) Senior V...
    The Requirement of Future Substrate - iNEMI
    http://thor.inemi.org
  • May 29-June 1, 2012-No2- K.Tanaka SHINKO IBM SYMPOSIUM Nov. 13th‘2012 Page 2 Contents 1. L...
    Coreless Substrate and its Extension - IBM - United States
    http://www-03.ibm.com
  • A wiring substrate includes a first insulation layer, a wiring layer formed on an upper su...
    Wiring substrate - SHINKO ELECTRIC INDUSTRIES CO., LTD. ...
    http://www.freepatentsonline.c
  • ‘Global and China IC Substrate Industry Report, 2015’ highlights the followings: 1. Status...
    全球和中國的IC基板產業分析 - GII
    http://www.giichinese.com.tw
  • The patent's assignee for patent number 9736941 is SHINKO ELECTRIC INDUSTRIES CO., LTD...
    SHINKO ELECTRIC INDUSTRIES : Patent Issued for Wiring Substr ...
    http://www.4-traders.com
  • IC substrates represent the highest level of miniaturization in PCB manufacturing and shar...
    IC Substrates - TTM Technologies, Inc.
    http://www.ttmtech.com
  • Flip Chip is a point-to-point interconnection method with so called solder bumps for elect...
    IC Package Substrates | IBIDEN's Principal Products | ...
    http://www.ibiden.com
  • Related to the recent performance improvement of electronic devices using Build-up Substra...
    Build-up Substrate(Flip-chip type) | IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • IC Package/ Build-up Substrate. DLL3® (Coreless Substrate). Concept ...
    DLL3(Coreless Substrate) | IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • Optimization of substrate design considering electrical performance; High density wiring b...
    IVH 3(Coreless Substrate ) P-BGA Substrate | IC Package | SHINKO ...
    http://www.shinko.co.jp
  • IC Package/ Build-up Substrate. DLL® (Direct Laser & Lamination). Concept ...
    DLL Build-up Substrate| IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • Lower cost; High reliability substrate application is possible; Optimization of substrate ...
    2L4L P-BGA Substrate | IC Package | SHINKO ELECTRIC ...
    http://www.shinko.co.jp
  • Advanced organic substrate technologies to enable high density lines and fine diameter via...
    Advanced fine-line technologies on organic substrates | R&D ...
    http://www.shinko.co.jp
  • Optimization of substrate design considering electrical performance; High density wiring b...
    IVH (Build-up Substrate with core) P-BGA Substrate | IC Package ...
    http://www.shinko.co.jp
  • 2011年6月20日 - SHINKO has started volume production for DLL3Ⓡ. ( DLL3Ⓡ is SHINKO's ... ...
    [PDF] SHINKO Coreless Substrate DLL3 in High Volume Production
    http://www.shinko.co.jp
  • Fine-pitch routing on the substrate enables cost reduction. The interposer board can be ei...
    System in Package| Products & Services | SHINKO ELECTRIC ...
    http://www.shinko.co.jp